Heat Spreading Performance of Integrated IGBT Module with Bonded Vapour Chamber for Electric Vehicle

Li, Bo, Chen, Yiyi, Yan, Yuying, Wang, Xuehui, Li, Yong, Wang, Yangang (2021) Heat Spreading Performance of Integrated IGBT Module with Bonded Vapour Chamber for Electric Vehicle. In: Advances in Heat Transfer and Thermal Engineering. Proceedings of the 16th UK Heat Transfer Conference. . pp. 509-515. Springer ISBN 978-981-334-765-6. (doi:10.1007/978-981-33-4765-6_88) (Access to this publication is currently restricted. You may be able to access a copy if URLs are provided) (KAR id:88957)

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Official URL: https://doi.org/10.1007/978-981-33-4765-6_88

Abstract

Single-phase cooling technologies included air, water glycol, etc., are most-used in thermal management of IGBT modules. With increasing heat dissipation, however, it is predicted that conventional air cooling solution is difficult to meet cooling demand sufficiently, especially when the power dissipation exceeds up to 1500 W.

Item Type:	Conference or workshop item (Paper)
DOI/Identification number:	10.1007/978-981-33-4765-6_88
Subjects:	Q Science
Divisions:	Divisions > Division of Computing, Engineering and Mathematical Sciences > School of Engineering and Digital Arts
Depositing User:	Bo Li
Date Deposited:	01 Jul 2021 10:58 UTC
Last Modified:	05 Nov 2024 12:54 UTC
Resource URI:	https://kar.kent.ac.uk/id/eprint/88957 (The current URI for this page, for reference purposes)

University of Kent Author Information

Li, Bo.

Creator's ORCID:	https://orcid.org/0000-0002-1973-1570
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