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Electroplated Mounting of Diamond Anvils for use in Cryogenic Systems

Pugh, Emma, Haselwimmer, R.K.W. (2006) Electroplated Mounting of Diamond Anvils for use in Cryogenic Systems. Review of Scientific Instruments, 77 (8). Article Number 085103. ISSN 0034-6748. (doi:10.1063/1.2238692) (The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided) (KAR id:84494)

The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided.
Official URL:
https://doi.org/10.1063/1.2238692

Abstract

The mounting of diamonds using the electroplated deposition of copper was originally developed to hold diamonds in place during polishing. This article describes the extension and application of this method for the mounting of diamonds inside diamond anvil cells. The novel method described, unlike more traditional gluing or clamping methods, can withstand both continual thermal cycling and provide a small profile such that it can be used in miniature cells to permit ample space for fitting electrical feed throughs or external coils around the anvils. The method is developed such that it can be used to attach the diamond to nonmetallic backing plates such as sapphire. Details of precautions to reduce the production of eddy currents in the deposited copper when performing ac-susceptibility measurements are also described.

Item Type: Article
DOI/Identification number: 10.1063/1.2238692
Subjects: Q Science > QC Physics
Divisions: Divisions > Division of Natural Sciences > Physics and Astronomy
Depositing User: Emma Pugh
Date Deposited: 27 Nov 2020 16:24 UTC
Last Modified: 16 Nov 2021 10:27 UTC
Resource URI: https://kar.kent.ac.uk/id/eprint/84494 (The current URI for this page, for reference purposes)

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