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Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module

Chen, Yiyi, Li, Bo, Yan, Yuying, Wang, Yangang, Qi, Fang (2019) Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module. Thermal Science and Engineering Progress, 10 . pp. 73-81. ISSN 2451-9049. (doi:10.1016/j.tsep.2019.01.007) (The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided) (KAR id:87700)

The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided. (Contact us about this Publication)
Official URL
https://doi.org/10.1016/j.tsep.2019.01.007

Abstract

Thermal stress in IGBT power module can lead to sever thermal reliability problems such as module deformation, performance degradation and even permanent damage. So, it is important to develop innovative and efficient IGBT cooling technologies. In this paper, a novel thermal management system is developed for cooling IGBT power module. The module is integrated with a vapour chamber-based heat sink to reduce thermal resistance and improve temperature uniformity significantly. 3D FEM modelling is conducted to investigate the effect of vapour chamber on temperature distribution, thermal stress, energy strain dissipation density and lifetime under power cycle. The simulation results show that the proposed thermal management system is superior to traditional cooling solution regarding cooling capacity, thermal stress, creep and plastic strain energy dissipation and thermal fatigue life. The study of failure mechanism of solder layer under power cycling suggests that creep causes the main is damage in the power cycling and cracks induced by thermal loading can be expected to initiate at the edge.

Item Type: Article
DOI/Identification number: 10.1016/j.tsep.2019.01.007
Uncontrolled keywords: IGBT power electronics; Electric vehicles; Phase change cooling; Vapour chamber; Thermal resistance; Thermal stress; Thermal fatigue
Subjects: T Technology > TJ Mechanical engineering and machinery
T Technology > TJ Mechanical engineering and machinery > Control engineering
Divisions: Divisions > Division of Computing, Engineering and Mathematical Sciences > School of Engineering and Digital Arts
Depositing User: Amy Boaler
Date Deposited: 21 Apr 2021 12:07 UTC
Last Modified: 22 Apr 2021 09:59 UTC
Resource URI: https://kar.kent.ac.uk/id/eprint/87700 (The current URI for this page, for reference purposes)
Li, Bo: https://orcid.org/0000-0002-1973-1570
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