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Fabrication and thermal performance of a novel roll-bond flat thermosyphon

Deng, Liqiang, Li, Yong, Xu, Peiken, Chen, Zhaoshu, Zhou, Wenjie, Li, Bo (2020) Fabrication and thermal performance of a novel roll-bond flat thermosyphon. Applied Thermal Engineering, 181 . Article Number 115959. ISSN 1359-4311. (doi:10.1016/j.applthermaleng.2020.115959) (The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided) (KAR id:87682)

The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided. (Contact us about this Publication)
Official URL
https://doi.org/10.1016/j.applthermaleng.2020.1159...

Abstract

In this work, a novel wickless heat pipe fabricated using the roll-bond process and called the roll-bond flat thermosyphon was proposed for electronic component cooling due to its slim and large-size configuration, low-cost, and mass-production capable. The thermal performance of roll-bond flat thermosyphon was investigated through the tests in terms of 3 typical structures (stagger, cross and align) and 4 filling ratios (5%, 10%, 20%, and 40%) under the increasing heat power, and evaluated with the effective thermal conductivity and the maximum heat transfer capacity. The phenomena of boiling regime evolution, geyser effect, liquid entrainment and dry-out, can be found through the temperature responses in the cases of progressive filling ratios and heating powers. The cross-structured sample was found to behave the worst among the three structures due to its blocked up-flowing inflated circuits. The highest effectivity thermal conductivity of 22404 (W/K·m) was found in the 5%-align sample, however, accompanied with early dry-out. The heat transfer capability is positive correlated to the filling ratio, and maximum heat transfer capacity of 100 W (heat flux of 14.9 (kW/m2)) was recorded in the stagger-40% sample. The 20%-stagger sample is recommended as the optimum design, due to its more stable and relative high thermal conductivity, which is peaked to 16019 (W/K·m), and averaged at 12616 (W/K·m) in the range of 0–90 W.

Item Type: Article
DOI/Identification number: 10.1016/j.applthermaleng.2020.115959
Uncontrolled keywords: Heat pipe; ThermosyphonAluminium; roll-bond process; Thermal performance; Liquid pool boiling; Gravity assisted
Subjects: T Technology > TJ Mechanical engineering and machinery
T Technology > TJ Mechanical engineering and machinery > Control engineering
Divisions: Divisions > Division of Computing, Engineering and Mathematical Sciences > School of Engineering and Digital Arts
Depositing User: Amy Boaler
Date Deposited: 20 Apr 2021 10:18 UTC
Last Modified: 21 Apr 2021 12:06 UTC
Resource URI: https://kar.kent.ac.uk/id/eprint/87682 (The current URI for this page, for reference purposes)
Li, Bo: https://orcid.org/0000-0002-1973-1570
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