Characterisation of TFMS Lines Fabricated Using Photoimageable Thick-Film Technology

Ng, Catherine Y and Chongcheawchamnan, Mitchai and Aftanasar, M.S. and Robertson, Ian D. and Young, Paul R. and Minalgiene, J. (2003) Characterisation of TFMS Lines Fabricated Using Photoimageable Thick-Film Technology. In: IEE Proceedings: Microwaves, Antennas and Propagation, 2003 June. (The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided)

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This paper describes the performance of thin-film microstrip (TFMS) transmission lines and passive components fabricated using photoimageable thick-film technology. The fabrication of narrow conductors (down to 15 μm) and small feature size via holes is made possible by adding a photoimaging process into the conventional thick-film screen-printing process. With this, thin-film microstrip (TFMS) structures can be implemented, whereas traditional thick-film technology cannot produce such narrow linewidths. TFMS is extremely attractive for the high levels of circuit integration desired in multichip modules (MCMs). Wideband characterisation of these TFMS lines has been performed over the frequency range 1–110 GHz using the TRL calibration technique. The effects of coupling between line segments and discontinuities at bends in meandered lines have also been studied. Miniaturised hybrid couplers are then demonstrated using the photoimageable technology.

Item Type: Conference or workshop item (Paper)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800 Electronics (see also: telecommunications) > TK7871.6 Antennas and waveguides
Divisions: Faculties > Science Technology and Medical Studies > School of Engineering and Digital Arts > Broadband & Wireless Communications
Depositing User: Yiqing Liang
Date Deposited: 29 Jun 2011 13:59
Last Modified: 15 Jul 2014 11:08
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