Waveguide Packaging at MM-Wave Frequencies

Jastrzebski, Adam K. and Yip, Jimmy G. M. and Li, Daiqing (2002) Waveguide Packaging at MM-Wave Frequencies. In: MIKON 2002 14th Interntional Conference on Microwaves, Radar and Wireless Communications, Gdansk (invited paper), 2002 May. (The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided)

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Waveguides can be used as both packaging cases and interconnection media between chips. No bond wires are needed in this packaging technique and, consequently, it can be used in millimetre wave circuits and systems. However, a chip inserted in a waveguide introduces additional unwanted propagation modes and reduces an effective bandwidth of the structure. The paper analyses the effects of the substrate thickness and of the placement of the chip on the bandwidth of WR6 and WR10 waveguide packages for typical GaAs and InP chip dimensions. The conditions for an optimum placement of the chip and a maximum bandwidth are derived and confirmed by a rigorous 3D electromagnetic simulation. Based on this analysis, the jig for testing of chips packaged in WR10 waveguide is designed, constructed and measured. Some performance problems are identified and confirmed through electromagnetic simulation. An improved jig design is then proposed.

Item Type: Conference or workshop item (Paper)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800 Electronics (see also: telecommunications) > TK7871.6 Antennas and waveguides
Divisions: Faculties > Science Technology and Medical Studies > School of Engineering and Digital Arts > Broadband & Wireless Communications
Depositing User: Yiqing Liang
Date Deposited: 29 Jun 2011 13:55
Last Modified: 27 May 2014 07:30
Resource URI: https://kar.kent.ac.uk/id/eprint/7440 (The current URI for this page, for reference purposes)
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