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Waveguide Packaging at MM-Wave Frequencies

Jastrzebski, Adam K. and Yip, Jimmy G. M. and Li, Daiqing (2002) Waveguide Packaging at MM-Wave Frequencies. In: 14th International Conference on Microwaves, Radar and Wireless Communications. IEEE, pp. 121-135. ISBN 83-906662-5-1. (doi:10.1109/MIKON.2002.1017820) (The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided) (KAR id:7440)

The full text of this publication is not currently available from this repository. You may be able to access a copy if URLs are provided.
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Waveguides can be used as both packaging cases and interconnection media between chips. No bond wires are needed in this packaging technique and, consequently, it can be used in millimetre wave circuits and systems. However, a chip inserted in a waveguide introduces additional unwanted propagation modes and reduces an effective bandwidth of the structure. The paper analyses the effects of the substrate thickness and of the placement of the chip on the bandwidth of WR6 and WR10 waveguide packages for typical GaAs and InP chip dimensions. The conditions for an optimum placement of the chip and a maximum bandwidth are derived and confirmed by a rigorous 3D electromagnetic simulation. Based on this analysis, the jig for testing of chips packaged in WR10 waveguide is designed, constructed and measured. Some performance problems are identified and confirmed through electromagnetic simulation. An improved jig design is then proposed.

Item Type: Book section
DOI/Identification number: 10.1109/MIKON.2002.1017820
Uncontrolled keywords: packaging; frequency; electromagnetic waveguides; bandwidth; integrated circuit interconnections; bonding; wires; circuits and systems; gallium arsenide; indium phosphide
Subjects: T Technology > TK Electrical engineering. Electronics. Nuclear engineering > TK7800 Electronics > TK7871.6 Antennas and waveguides
Divisions: Divisions > Division of Computing, Engineering and Mathematical Sciences > School of Engineering and Digital Arts
Depositing User: Yiqing Liang
Date Deposited: 29 Jun 2011 13:55 UTC
Last Modified: 16 Nov 2021 09:45 UTC
Resource URI: (The current URI for this page, for reference purposes)

University of Kent Author Information

Jastrzebski, Adam K..

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